“Every chipmaker on earth is now racing to match Huawei's hybrid bonding, and Applied Materials sells the picks and shovels — holding a 9%+ stake in BESI, the dominant hybrid bonding tool maker, and co-developing the inline bonding systems now being adopted at TSMC, SK Hynix, Samsung, and Micron.”
“SWEET”
Prices are point-in-time snapshots from the named provider. The verdict compares the return since entry against the band above.