Back
“Huawei just confirmed wafer-to-wafer hybrid bonding is the gating technology for its Kirin 2026 chip, and Applied Materials built the only high-volume-ready bonding system on the market, plus took a 9% stake in BESI, the top bonding equipment maker — its hybrid bonding revenue is on track to hit €476M in 2026, up from €36M in 2023.”
Source
ZephyrX“Looks like LogicFolding uses W2W Hybrid Bonding
…”span
“Looks like LogicFolding uses W2W Hybrid Bonding We previously thought that it would be D2D Hybrid Bonding”
Performance
Entry$632.12
Current$603.04
Since call-4.60%
Confidence72%
How this was scored
Entry$632.12Jul 4, 2026 · 10:03 UTC · paste.trade
Current$579.28Jul 15, 2026 · 18:18 UTC · Finnhub
Horizonfall 2026parsed as fall-2026
Verdict bandWIN ≥ +2% · LOSS ≤ −2%
Prices are point-in-time snapshots from the named provider. The verdict compares the return since entry against the band above.