“Samsung just built the world's densest NAND chip, a 900-layer class flash memory using a new bonding technique, while the entire NAND market is sold out and prices are surging 70-75%.”
“Samsung's Cell Multi-Bonding (CMB) samples went further, with a dual-450L (3-deck) mechanical sample and a dual-155L (1-deck) electrical sample.”
Prices are point-in-time snapshots from the named provider. The verdict compares the return since entry against the band above.